An Outlier Removal Method for SPC in Semiconductor Manufacturing-Reference-Cited by-同舟云学术

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An Outlier Removal Method for SPC in Semiconductor Manufacturing

Published:2010-07-01 Issue:4 Volume:3 Page:292-298
ISSN:1882-4889
Container-title:SICE Journal of Control, Measurement, and System Integration
language:en
Short-container-title:SICE Journal of Control, Measurement, and System Integration

Author:

Kubo Tomoaki¹²,Minami Masateru³,Homma Tetsuya⁴

Affiliation:

1. Functional Control Systems, Shibaura Institute of Technology

2. Corporate Manufacturing Engineering Center, Toshiba Corporation

3. Research Center for Advanced Science and Technology, The University of Tokyo

4. Department of Electronic Engineering, Shibaura Institute of Technology

Publisher

Informa UK Limited

Link

https://www.tandfonline.com/doi/pdf/10.9746/jcmsi.3.292

Reference9 articles.

1. A Statistical Process Control Method for Semiconductor Manufacturing

2. [2] F. E. Grubbs: Sample criteria for testing outlying observations, The Annals of Mathematical Statistics, Vol. 21, No. 1, pp. 27-58, 1950.

3. [3] F. E. Grubbs: Procedures for detecting outlying observations in samples, Technometrics, Vol. 11, No. 1, pp. 1-21, 1969.

4. [4] D. C. Hoaglin, B. Iglewicz, and J. W. Tukey: Performance of some resistant rules for outlier labeling, Journal of the American stastical Association, Vol. 81, No. 396, pp. 991-999, 1986.

5. [5] W. J. Dixon: Analysis of extreme values, The Annals of Mathematical Statistics, Vol. 21, No. 4, pp. 488-506, 1950.

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