On the simultaneous inversion of micro-perforated panels' parameters: Application to single and double air-cavity backed systems-Reference-Cited by-同舟云学术

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On the simultaneous inversion of micro-perforated panels' parameters: Application to single and double air-cavity backed systems

Published:2018-04 Issue:4 Volume:143 Page:2279-2288
ISSN:0001-4966
Container-title:The Journal of the Acoustical Society of America
language:en
Short-container-title:The Journal of the Acoustical Society of America

Author:

Tayong Rostand B.¹,Manyo Manyo Jacques A.²,Siryabe Emmanuel³,Ntamack Guy E.²

Affiliation:

1. Department of Mechanical Engineering, University of Bristol, University Walk, Bristol, BS8 1TR, United Kingdom

2. Groupe de Mécanique, Matériaux et Acoustique, Département de Physique, Université de Ngaoundéré, Ngaoundéré, B.P. 454, Cameroon

3. Laboratoire Ondes et Milieux Complexes (LOMC), UMR CNRS 6294, Université du Havre, Le Havre, France

Publisher

Acoustical Society of America (ASA)

Subject

Acoustics and Ultrasonics,Arts and Humanities (miscellaneous)

Link

http://asa.scitation.org/doi/pdf/10.1121/1.5032312

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Assessing acoustic performance of building material: A finite element model for 3D printed multilayer micro-perforated panels with compressed earth blocks;Building Acoustics;2024-08-05

2. Passive and active low frequency sound absorption performance of the finite and large sized micro-perforated panel absorber on oblique incidence condition;Journal of Sound and Vibration;2023-03

3. Low frequency sound absorption performance of large sized active micro-perforated panel absorber in free field;Acta Physica Sinica;2023

4. Structural acoustic controlled active micro-perforated panel absorber for improving wide-band low frequency sound absorption;Mechanical Systems and Signal Processing;2022-10

5. An Empirical Model for Optimizing the Sound Absorption of Single Layer MPP Based on Response Surface Methodology;International Journal of Technology;2022-07-01

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