Massive metrology and inspection solution for EUV by area inspection SEM with machine learning technology-Reference-Cited by-同舟云学术

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Massive metrology and inspection solution for EUV by area inspection SEM with machine learning technology

Published:2021-02-22 Issue: Volume: Page:
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Container-title:Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV
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Author:

Kondo Tsuyoshi,Ban Naoma,Ebizuka Yasushi,Toyoda Yasutaka,Yamada Yukari,Kashiwa Taeko,Koike Hirohito,Shindo Hiroyuki,Charley Anne-Laure,Saib Mohamed,Van Roey Frieda,De Bisschop Peter,De Simone Danilo,Beral Christophe,Lorusso Gian F.

Publisher

SPIE

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Towards improved semiconductor defect inspection for high-NA EUVL based on SEMI-SuperYOLO-NAS;Metrology, Inspection, and Process Control XXXVIII;2024-04-10

2. Rigorous 3D probabilistic computational lithography and chip-level inspection for EUV stochastic failure detection;International Conference on Extreme Ultraviolet Lithography 2023;2023-11-21

3. Defect inspection in semiconductor images using FAST-MCD method and neural network;The International Journal of Advanced Manufacturing Technology;2023-10-03

4. Semiconductor Multilayer Nanometrology with Machine Learning;Nanomanufacturing and Metrology;2023-05-04

5. Defect Inspection in Semiconductor Images Using FAST-MCD Method and Neural Network;2023-03-20

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