High power diode laser array development using completely indium free packaging technology with narrow spectrum-Reference-Cited by-同舟云学术

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High power diode laser array development using completely indium free packaging technology with narrow spectrum

Published:2016-04-22 Issue: Volume: Page:
ISSN:0277-786X
Container-title:Components and Packaging for Laser Systems II
language:
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Author:

Hou Dong,Wang Jingwei,Gao Lijun,Liang Xuejie,Li Xiaoning,Liu Xingsheng

Publisher

SPIE

Reference10 articles.

1. Scalable highbrightness laser pump for aerospace applications;Rugi,2003

2. High-Power Diode Lasers for Direct Applications;Brauch,2000

3. Laser AnalyticalSpectroscope;Bolshov,2001

4. A study on the reliability of indium solder die bonding of high power semiconductor lasers

5. [Packaging of high power semiconductor lasers];Liu,2014

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Study on die-bonding of single emitter high power laser diodes;Optical Engineering;2022-03-02

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