Fabrication of fiber-embedded boards using grooving technique for optical interconnection applications
Author:
Publisher
SPIE-Intl Soc Optical Eng
Subject
General Engineering,Atomic and Molecular Physics, and Optics
Reference12 articles.
1. Optical interconnects in systems
2. Optically interconnected electronic chips: a tutorial and review of the technology
3. Linking with light [high-speed optical interconnects]
4. Design and implementation of a modulator-based free-space optical backplane for multiprocessor applications
5. 3-Gb/s data transmission with GaAs VCSELs over PCB integrated polymer waveguides
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4. Thermally stable and low-loss optical waveguide using optical-fiber-embedded epoxy matrix for optical printed-circuit board applications;SPIE Proceedings;2010-02-11
5. Optical Interconnection Platform Composed of Fiber-Embedded Board, 90$^{\circ}$-Bent Fiber Block, and 10-Gb/s Optical Module;Journal of Lightwave Technology;2008-06
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