Implementation of hybrid metrology at HVM fab for 20nm and beyond-Reference-Cited by-同舟云学术

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Implementation of hybrid metrology at HVM fab for 20nm and beyond

Published:2013-04-10 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
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Author:

Vaid Alok,Subramany Lokesh,Iddawela Givantha,Ford Carl,Allgair John,Agrawal Gaurav,Taylor John,Hartig Carsten,Kang Byung Cheol (Charles),Bozdog Cornel,Sendelbach Matthew,Isbester Paul,Issascharoff Limor

Publisher

SPIE

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Spectral interferometry for fully integrated device metrology;Journal of Micro/Nanopatterning, Materials, and Metrology;2023-02-21

2. Vertical travelling scatterometry for metrology on fully integrated devices;Metrology, Inspection, and Process Control XXXVI;2022-05-26

3. Expanded area metrology for tip-based wafer inspection in the nanomanufacturing of electronic devices;Journal of Micro/Nanolithography, MEMS, and MOEMS;2019-09-05

4. A tip-based metrology framework for real-time process feedback of roll-to-roll fabricated nanopatterned structures;Precision Engineering;2019-05

5. Measuring self-aligned quadruple patterning pitch walking with scatterometry-based metrology utilizing virtual reference;Journal of Micro/Nanolithography, MEMS, and MOEMS;2016-10-25

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