Hybrid metrology for critical dimension based on scanning methods for IC manufacturing

Author:

Foucher J.,Figueiro N. Griesbach Schuch,Rouxel J.,Thérèse R.

Publisher

SPIE

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Research on Tip Characterization Techniques Based on Two-Dimensional Self-Traceable Nano-Gratings;Photonics;2023-11-17

2. Apparent size effects on dopant activation in nanometer-wide Si fins;Journal of Vacuum Science & Technology B;2021-03

3. Scatterometry and AFM measurement combination for area selective deposition process characterization;Metrology, Inspection, and Process Control for Microlithography XXXIII;2019-03-26

4. 3D-AFM Measurements for Semiconductor Structures and Devices;Metrology and Diagnostic Techniques for Nanoelectronics;2016-11-23

5. Real-time inspection system utilizing scatterometry pupil data;Journal of Micro/Nanolithography, MEMS, and MOEMS;2014-09-19

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