Scatterometry and AFM measurement combination for area selective deposition process characterization-Reference-Cited by-同舟云学术

Scatterometry and AFM measurement combination for area selective deposition process characterization

Published:2019-03-26 Issue: Volume: Page:
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Container-title:Metrology, Inspection, and Process Control for Microlithography XXXIII
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Author:

Saib Mohamed,Moussa Alain,Charley Anne-Laure,Leray Philippe,Hung Joey,Koret Roy,Turovets Igor,Ger Avron,Deng Shaoren,Illiberi Andrea,Maes Jan Willem,Woodworth Gabriel,Strauss Michael

Publisher

SPIE

Reference11 articles.

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2. A Holistic Metrology Approach: Hybrid Metrology Utilizing Scatterometry, CD-AFM and CD-SEM;Vaid,2011

3. CDSEM AFM Hybrid metrology for the characterization of Gate-All-Around Silicon Nano Wires;Levi,2014

4. Hybrid reference metrology exploiting patterning simulation;Rana,2010

5. Hybrid metrology for critical dimension based on scanning methods for IC manufacturing;Foucher,2012

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1. Metrology;2021 IEEE International Roadmap for Devices and Systems Outbriefs;2021-11

2. Area-Selective Deposition: Fundamentals, Applications, and Future Outlook;Chemistry of Materials;2020-05-14

3. Inherently Selective Atomic Layer Deposition and Applications;Chemistry of Materials;2020-02-26

4. Size-dependent optical properties of periodic arrays of semiconducting nanolines;Optics Express;2020-02-21

5. Localized power spectral density analysis on atomic force microscopy images for advanced patterning applications;Metrology, Inspection, and Process Control for Microlithography XXXIII;2019-03-26