Author:
Yang Yi-Yeh,Lee Hsuan-Ping,Liu Chun-Hung,Yu Hao-Yun,Tsai Kuen-Yu,Li Jia-Han
Reference20 articles.
1. 3D features measurement using YieldStar, an angle resolved polarized scatterometer;Charley,2011
2. Direct-scatterometry-enabled lithography model calibration;Chen,2012
3. Chih-Yu Chen, Philip C.W. Ng, Chun-Hung Liu, Yu-Tian Shen, Kuen-Yu Tsai, Jia-Han Li, Jason J. Shieh, and Alek C. Chen, “Direct-scatterometry-enabled optical-proximity-correction-model calibration,” Advanced Lithography 2013--Proc. SPIE Vol. S6S1, Metrology, Inspection, and Process Control for Microlithography XXVII, S6S10U, San Jose, California, USA, Feb. 2013.
4. Toward 22 nm: fast and effective intrafield monitoring and optimization of process windows and critical dimension uniformity
5. Role of ellipsometry in DPT process characterization and impact of performance for contact holes;Kamohara,2011