High-throughput and non-destructive sidewall roughness measurement using 3-dimensional atomic force microscopy-Reference-Cited by-同舟云学术

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High-throughput and non-destructive sidewall roughness measurement using 3-dimensional atomic force microscopy

Published:2012-03-29 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
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Author:

Hua Yueming,Buenviaje-Coggins Cynthia,Lee Yong-ha,Park Sang-il

Publisher

SPIE

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Advancements in metrology for advanced semiconductor packaging;Optics and Photonics for Advanced Dimensional Metrology III;2024-06-18

2. Automated measurement and analysis of sidewall roughness using three-dimensional atomic force microscopy;Applied Microscopy;2022-03-08

3. Line edge roughness measurement on vertical sidewall for reference metrology using a metrological tilting atomic force microscope;Journal of Micro/Nanolithography, MEMS, and MOEMS;2020-03-23

4. Accurate vertical sidewall measurement by a metrological tilting-AFM for reference metrology of line edge roughness;Metrology, Inspection, and Process Control for Microlithography XXXIII;2019-03-26

5. In-Line Critical Dimension and Sidewall Roughness Metrology Study for Compound Nanostructure Process Control by in-Line 3D Atomic Force Microscope;ECS Transactions;2016-08-18

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