On-product overlay enhancement using advanced litho-cluster control based on integrated metrology, ultra-small DBO targets and novel corrections-Reference-Cited by-同舟云学术

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On-product overlay enhancement using advanced litho-cluster control based on integrated metrology, ultra-small DBO targets and novel corrections

Published:2013-04-10 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
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Author:

Bhattacharyya Kaustuve,Ke Chih-Ming,Huang Guo-Tsai,Chen Kai-Hsiung,Smilde Henk-Jan H.,Fuchs Andreas,Jak Martin,van Schijndel Mark,Bozkurt Murat,van der Schaar Maurits,Meyer Steffen,Un Miranda,Morgan Stephen,Wu Jon,Tsai Vincent,Liang Frida,den Boef Arie,ten Berge Peter,Kubis Michael,Wang Cathy,Fouquet Christophe,Terng L. G.,Hwang David,Cheng Kevin,Gau TS,Ku Y. C.

Publisher

SPIE

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Non-integral model-based scatterometry for CD metrology of single high-aspect-ratio microstructures;Surface Topography: Metrology and Properties;2023-05-05

3. Improved multi-lot overlay performance via phase based ADI overlay measurements;Metrology, Inspection, and Process Control XXXVI;2022-05-26

4. Selection of DBO measurement wavelength for bottom mark asymmetry based on FDTD method;Journal of Semiconductors;2019-12-01

5. A diffraction-based overlay model based on FDTD method;Metrology, Inspection, and Process Control for Microlithography XXXIII;2019-03-26

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