<title>Development Of A Three-Dimensional Circuit Integration Technology And Computer Architecture

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Development Of A Three-Dimensional Circuit Integration Technology And Computer Architecture

Published:1981-12-29 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
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Author:

Etchells R. D.,Grinberg J.,Nudd G. R.

Publisher

SPIE

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Process technology for packing applications;Thin Solid Films;1988-12

2. Technological developments for three-dimensional circuitry;WOPPLOT 86 Parallel Processing: Logic, Organization, and Technology;1987

3. Three-dimensional VLSI architecture for image understanding;Journal of Parallel and Distributed Computing;1985-02

4. Three-Dimensional VLSI;Journal of the ACM;1983-07

5. Diodes formed by laser drilling and diffusion;Journal of Applied Physics;1982-12

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