Process technology for packing applications
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference9 articles.
1. On a Pin Versus Block Relationship For Partitions of Logic Graphs
2. Chip-Module Package Interfaces
3. Thermal Conduction Module: A High-Performance Multilayer Ceramic Package
4. Proc. 37th Electronic Components Conf.;Lane,1987
5. Microelectronic Packaging
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4. Synthesis and characterization of novel polyimide from bis-(3-aminophenyl)-4-(trifluoromethyl)phenyl phosphine oxide;Journal of Polymer Science Part A: Polymer Chemistry;2001
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