Development of full-fill bottom antireflective coatings for dual-damascene process-Reference-Cited by-同舟云学术

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Development of full-fill bottom antireflective coatings for dual-damascene process

Published:2001-08-24 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
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Author:

Wang Yubao,Wu Xiaoming,Xu Gu,Lamb III James E.,Sullivan John,Claypool James B.,Backus Jackie,Trautman Sean,Shao Xie,Takei Satoshi,Sone Yasuhisa,Mizusawa Kenichi,Fukuro Hiroyoshi

Publisher

SPIE

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reduction of pattern peeling in step-and-flash imprint lithography;Microelectronic Engineering;2014-03

2. Resist Poisoning Studies of Gap Fill Materials for Patterning Metal Trenches in Via-First Dual Damascene Process;Japanese Journal of Applied Physics;2008-12-19

3. Ultraviolet cross-link process using spin-coating materials for advanced planarization and sublimate defect reduction;SPIE Proceedings;2008-08-28

4. Development of Developer-Soluble Gap Fill Materials for Planarization in Via-First Dual Damascene Process;Japanese Journal of Applied Physics;2008-05-16

5. High-etch-rate bottom-antireflective coating and gap-fill materials using dextrin derivatives in via first dual-damascene lithography process;Advances in Resist Materials and Processing Technology XXV;2008-03-14

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