The analysis of EUV mask defects using a wafer defect inspection system-Reference-Cited by-同舟云学术

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The analysis of EUV mask defects using a wafer defect inspection system

Published:2010-03-11 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
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Author:

Cho Kyoung-Yong,Park Joo-On,Park Changmin,Lee Young-Mi,Kang In-Yong,Yeo Jeong-Ho,Choi Seong-Woon,Park Chan-Hoon,Lange Steven R.,Cho SungChan,Danen Robert M.,Kirk Gregory L.,Pae Yeon-Ho

Publisher

SPIE

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Automatic Wafer Defect Classification Based on Decision Tree of Deep Neural Network;2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2022-05-02

2. Defect detection strategies and process partitioning for single-expose EUV patterning;Journal of Micro/Nanolithography, MEMS, and MOEMS;2018-09-05

3. E-beam inspection of EUV mask defects: To etch or not to etch?;SPIE Proceedings;2014-04-17

4. Simulation Analysis of the Characteristics of a High Magnification Imaging Optics for the Observation of Extreme Ultraviolet Lithography Mask to Predict Phase Defect Printability;Japanese Journal of Applied Physics;2013-09-01

5. Defect management of EUV mask;SPIE Proceedings;2012-06-30

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