Pattern roughness analysis using power spectral density: application and impact in photoresist formulation-Reference-Cited by-同舟云学术

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Pattern roughness analysis using power spectral density: application and impact in photoresist formulation

Published:2021-01-28 Issue:01 Volume:20 Page:
ISSN:2708-8340
Container-title:Journal of Micro/Nanopatterning, Materials, and Metrology
language:
Short-container-title:J. Micro/Nanopattern. Mats. Metro.

Author:

Cutler Charlotte¹,Thackeray James W.²,Trefonas Peter²,Millward Dan²,Lee Choong-Bong²,Mack Chris³

Affiliation:

1. TEL Technology Center of America, Albany, New York

2. DuPont Electronics and Imaging, Marlborough, Massachusetts

3. Fractilia, LLC, Austin, Texas

Publisher

SPIE-Intl Soc Optical Eng

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Novel Process to Reduce Roughness in Chemically Amplified Resist (CAR) for Next-Generation Lithography;Journal of Photopolymer Science and Technology;2024-06-25

2. Roughness improvement by post-development treatment of CAR for high-NA EUV lithography;Advances in Patterning Materials and Processes XLI;2024-04-09

3. Thermally-induced nanoscale phase change in chalcogenide glass Cr₂Ge₂Te₆ revealed by scanning tunneling microscopy;Japanese Journal of Applied Physics;2024-01-01

4. Evaluation of the change in photoresist sidewall roughness due to electron beam-induced shrinkage using atomic force microscopy;Journal of Micro/Nanopatterning, Materials, and Metrology;2023-12-07

5. Mask absorber, mask tone, and wafer process impact on resist line-edge-roughness;Journal of Micro/Nanopatterning, Materials, and Metrology;2023-10-13

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