In-line E-beam wafer metrology and defect inspection: the end of an era for image-based critical dimensional metrology? New life for defect inspection
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Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Optical wafer defect inspection at the 10 nm technology node and beyond;International Journal of Extreme Manufacturing;2022-04-21
2. Deep Learning-Based High Throughput Inspection in 3D Nanofabrication and Defect Reversal in Nanopillar Arrays: Implications for Next Generation Transistors;ACS Applied Nano Materials;2021-03-09
3. Expanded area metrology for tip-based wafer inspection in the nanomanufacturing of electronic devices;Journal of Micro/Nanolithography, MEMS, and MOEMS;2019-09-05
4. Stochastic printing failures in extreme ultraviolet lithography;Journal of Micro/Nanolithography, MEMS, and MOEMS;2018-09-25
5. Inorganic hardmask development for extreme ultraviolet patterning;Journal of Micro/Nanolithography, MEMS, and MOEMS;2018-07-31
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