High-radiance LDP source for mask inspection application-Reference-Cited by-同舟云学术

High-radiance LDP source for mask inspection application

Published:2014-04-17 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
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Author:

Teramoto Yusuke¹,Santos Bárbara¹,Mertens Guido¹,Kops Ralf¹,Kops Margarete¹,Küpper Felix²,Niimi Gota³,Yabuta Hironobu³,Nagano Akihisa³,Yokoyama Takuma³,Yoshioka Masaki³,Shirai Takahiro³,Ashizawa Noritaka³,Sato Hiroto³,Nakamura Kiyotada³,Kasama Kunihiko³

Affiliation:

1. Ushio Inc. (Germany)

2. Fraunhofer-Institut für Lasertechnik (Germany)

3. Ushio Inc. (Japan)

Publisher

SPIE

Reference11 articles.

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3. Update from the SEMATECH EUV mask infrastructure initiative;Goldstien,2011

4. Enabling EUVL for HVM insertion;Phillips,2013

5. Sub-22nm EUV Imaging on SEMATECH Albany Micro Exposure Tool;Ashworth,2010

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