New reflow process for indium bump

Author:

Kim Young-Ho,Choi Jong Hwa,Choi Kang-Sik,Lee Hee Chul,Kim Choong-Ki

Publisher

SPIE

Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Performance of thermo-compression bonding for HgCdTe based focal plane array;Microelectronics Reliability;2024-09

2. Simulation study on thermal mechanical properties of 4×4 Micro-LED array in flip-chip bonding process;2021 18th China International Forum on Solid State Lighting & 2021 7th International Forum on Wide Bandgap Semiconductors (SSLChina: IFWS);2021-12-06

3. Phase Array Ultrasonic Transducer Based on a Flip Chip Bonding with Indium Solder Bump;2021 IEEE International Ultrasonics Symposium (IUS);2021-09-11

4. Fabrication of highly-uniform indium ball bumps for small unit-cell infrared focal plane arrays;AOPC 2020: Infrared Device and Infrared Technology;2020-11-05

5. Evaluation of hydrogen radical treatment for indium surface oxide removal and analysis of re-oxidation behavior;Japanese Journal of Applied Physics;2017-12-04

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