New reflow process for indium bump
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SPIE
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Performance of thermo-compression bonding for HgCdTe based focal plane array;Microelectronics Reliability;2024-09
2. Simulation study on thermal mechanical properties of 4×4 Micro-LED array in flip-chip bonding process;2021 18th China International Forum on Solid State Lighting & 2021 7th International Forum on Wide Bandgap Semiconductors (SSLChina: IFWS);2021-12-06
3. Phase Array Ultrasonic Transducer Based on a Flip Chip Bonding with Indium Solder Bump;2021 IEEE International Ultrasonics Symposium (IUS);2021-09-11
4. Fabrication of highly-uniform indium ball bumps for small unit-cell infrared focal plane arrays;AOPC 2020: Infrared Device and Infrared Technology;2020-11-05
5. Evaluation of hydrogen radical treatment for indium surface oxide removal and analysis of re-oxidation behavior;Japanese Journal of Applied Physics;2017-12-04
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