Evaluation of hydrogen radical treatment for indium surface oxide removal and analysis of re-oxidation behavior

Author:

Furuyama Kohta,Yamanaka Kazuyuki,Higurashi Eiji,Suga Tadatomo

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Hybrid bonding thermodynamic simulation of 3×3 array of Micro-LED fabricated based on flip-chip bonding;2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS);2023-11-27

2. Thermodynamic simulation of 6×6 Micro-LED array in flip-chip bonding;2022 19th China International Forum on Solid State Lighting & 2022 8th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS);2023-02-07

3. Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing;Materials;2021-10-21

4. Physics and Chemistry of Solid State Direct Reduction of Iron Ore by Hydrogen Plasma;Physics and Chemistry of Solid State;2021-05-26

5. Formation of CuCo Alloy From Their Oxide Mixtures Through Reduction by Low-Temperature Hydrogen Plasma;Plasma Chemistry and Plasma Processing;2019-03-01

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