Carbon nanotubes for next generation very large scale integration interconnects

Author:

Srivastava Ashok

Publisher

SPIE-Intl Soc Optical Eng

Subject

Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference96 articles.

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2. C. Ryu, K.-W. Kwon, A. L. S. Loke, H. Lee, T. Nogami, V. M. Dubin, R. A. Kavari, G. W. Ray, and S. S. Wong, "Microstructure and reliability of copper interconnects," IEEE Trans. Electron Dev. 46, 1113-1120 (1999) 10.1109/16.766872

3. D. A. B. Miller, "Optical interconnects to silicon," IEEE J. Sel. Top. Quantum Electron. 6, 1312-1317 (2000) 10.1109/2944. 902184

4. G. Chen, H. Chen, M. Haurylau, N. A. Nelson, D. H. Albonesi, P. M. Fauchet, and E. G. Friedman, "Predictions of CMOS compatible on-chip optical interconnect," Integrat. VLSI J. 40, 434-446 (2007) 10.1016/j.vlsi.2006. 10.001

5. P. Kapur and K. C. Saraswat, "Comparisons between electrical and optical interconnects for on-chip signaling," Proc. IEEE Int. Interconnect Technol. Conf., 89-91 (2002) 10.1109/IITC.2002.1014897

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