Arbitrary 3D linewidth form measurement simulations for the next-generation semiconductor circuits by scatterometry using the FDTD method-Reference-Cited by-同舟云学术

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Arbitrary 3D linewidth form measurement simulations for the next-generation semiconductor circuits by scatterometry using the FDTD method

Published:2004-05-24 Issue: Volume: Page:
ISSN:0277-786X
Container-title:Metrology, Inspection, and Process Control for Microlithography XVIII
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Author:

Shirasaki Hirokimi

Publisher

SPIE

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Oblique incidence scatterometry for 2D/3D isolation mounts with RCWA and PML;SPIE Proceedings;2016-03-18

2. 3D isolation mounts scatterometry with RCWA and PML;SPIE Proceedings;2015-03-19

3. Isolation mounts scatterometry with RCWA and PML;Metrology, Inspection, and Process Control for Microlithography XXVIII;2014-04-02

4. Scatterometry simulator development with GPU, real-coded GA and RCWA;SPIE Proceedings;2013-04-10

5. Scatterometry simulator using GPU and evolutionary algorithm;SPIE Proceedings;2011-03-17

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