Author:
Hirai Shin-Ichiro,Saito Nobuyuki,Goto Yoshio,Suda Hiromi,Mori Ken-Ichiro,Miura Seiya
Cited by
6 articles.
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1. Study of fine patterning lithography for panel level packaging;Journal of Micro/Nanopatterning, Materials, and Metrology;2024-01-02
2. Study of Large Exposure Field Lithography for Advanced Chiplet Packaging;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
3. Study of Submicron Panel-Level Packaging in Mass-Production;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06
4. Study of Submicron Patterning Exposure Tool for Fine 500 mm Panel Size FOPLP;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06
5. Sub-Micron RDL Patterning for Advanced Packaging;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05