Femtosecond laser micromachining of crystalline silicon for ablation of deep macro-sized cavities for silicon-on-insulator applications-Reference-Cited by-同舟云学术

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Femtosecond laser micromachining of crystalline silicon for ablation of deep macro-sized cavities for silicon-on-insulator applications

Published:2019-03-04 Issue: Volume: Page:
ISSN:
Container-title:Laser-based Micro- and Nanoprocessing XIII
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Author:

Bhaskar Arun,Philippe Justine,Braud Flavie,Okada Etienne,Robillard Jean-François,Gloria Daniel,Gaquiere Christophe,Dubois Emmanuel

Publisher

SPIE

Reference17 articles.

1. Compact diode-pumped 11 kW Yb:YAG Innoslab femtosecond amplifier

2. New fast galvo scanner head for high throughput micromachining

3. Heat accumulation during pulsed laser materials processing

4. A high-repetition-rate femtosecond laser for thin silicon wafer dicing

5. Micro and nano-structuration of silicon by femtosecond laser: Application to silicon photovoltaic cells fabrication

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Optimization strategy for high-quality laser milling of silicon;Optics & Laser Technology;2022-06

2. Large-area femtosecond laser milling of silicon employing trench analysis;Optics & Laser Technology;2021-06

3. Laser-induced oxidation-assisted micromilling of deep narrow microgroove on Inconel 718;The International Journal of Advanced Manufacturing Technology;2021-03-10

4. Substrate Engineering of Inductors on SOI for Improvement of Q-Factor and Application in LNA;IEEE Journal of the Electron Devices Society;2020

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