Application of advanced diffraction based optical metrology overlay capabilities for high-volume manufacturing

Author:

Chen Kai-Hsiung1,Huang Guo-Tsai1,Hsieh Hung-Chih1,Ni Wei-Feng1,Chuang S. M.1,Chuang T. K.1,Ke Chih-Ming1,Huang Jacky1,Rao Shiuan-An1,Cumurcu Gysen Aysegul2,d'Alfonso Maxime2,Yueh Jenny2,Izikson Pavel2,Soco Aileen2,Wu Jon2,Nooitgedagt Tjitte2,Ottens Jeroen2,Kim Yong Ho2,Ebert Martin2

Affiliation:

1. Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)

2. ASML Netherlands B.V. (Netherlands)

Publisher

SPIE

Reference6 articles.

1. A Novel Methodology for Triple/Multiple-Patterning Layout Decomposition;Ghaida,2012

2. Highly manufacturable FinFETs with sub-10nm fin width and high aspect ratio fabricated with immersion lithography;Van Dal,2007

3. Holistic approach using accuracy of diffraction-based integrated metrology to improve on-product performance, reduce cycle time and cost at litho;Bhattacharyya,2015

4. Tighter process control of poly- and active-to-contact overlay registration via multilayer analysis;Lee,2000

5. New approaches in diffraction based optical metrology;Ebert,2016

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