1. Plasma etching and integration challenges using alternative patterning techniques for 11nm node and beyond;Barnola,2014
2. Manufacturability considerations for DSA;Farrell,2014
3. Towards electrical testable SOI devices using Directed Self-Assembly for fin formation;Liu,2014
4. Sustainable scaling technique on double-patterning process;Yaegashi,2013
5. High speed EUV using post processing and self-aligned double patterning as a speed enhancement technique;Wandell,2014