The assessment of the impact of mask pattern shape variation on the OPC-modeling by using SEM-contours from wafer and mask-Reference-Cited by-同舟云学术

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The assessment of the impact of mask pattern shape variation on the OPC-modeling by using SEM-contours from wafer and mask

Published:2011-10-06 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
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Author:

Hibino Daisuke,Shindo Hiroyuki,Hojyo Yutaka,Do Thuy,Dave Aasutosh,Lin Timothy,Kusnadi Ir,Sturtevant John L.

Publisher

SPIE

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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