The CD control improvement by using CDSEM 2D measurement of complex OPC patterns

Author:

Chou William1,Cheng Jeffrey1,Lee Adder1,Cheng James1,Tzeng Alex C.2,Lu Colbert3,Yang Ray3,Lee Hong Jen3,Bandoh Hideaki4,Santo Izumi4,Zhang Hao4,Chen Chien Kang5

Affiliation:

1. United Microelectronics Corp. (Taiwan)

2. United Microelectronics Corp. (United States)

3. Photronics DNP Mask Corp. (Taiwan)

4. Holon Corp., Ltd. (Japan)

5. Lim Chemical Co., Ltd. (Taiwan)

Publisher

SPIE

Reference7 articles.

1. 2D measurement using CD SEM for arbitrarily shaped patterns;Lee,2007

2. Tradeoff between lithographic performance and mask cost of masks made by inverse lithography technology;Kim,2009

3. An optimized OPC and MDP flow for reducing mask write time and mask cost;Yang,2010

4. Generalization of shot definition for variable shaped e-beam machines for write time reduction;Sahouria,2010

5. Mask data correction methodology in the context of model-based fracturing and advanced mask models;Pierrat,2011

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