1. Development of chipping-free dicing technology applying electrophoretic deposition of ultrafine abrasives;Ikeno,1991
2. The application of micro-groove machining for the model of PDP barrier ribs;Cho,2001
3. Improvement of a dicing blade using a whisker direction-controlled by an electric field;Peng,2002
4. Development of a dicing blade with photopolymerizable resins for improving machinability;Lee,2005
5. High quality laser microcutting of difficult-to-cut materials - Copper and Si wafer;Lim,2002