Dash line glass- and sapphire-cutting with high power USP laser-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Dash line glass- and sapphire-cutting with high power USP laser

Published:2016-03-09 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
Short-container-title:

Author:

Mishchik Konstantin,Chassagne Bruno,Javaux-Léger Clémentine,Hönninger Clemens,Mottay Eric,Kling Rainer,Lopez John

Publisher

SPIE

Reference45 articles.

1. Laser glass cutting techniques: a review;Nisar,2013

2. New technology for laser cutting glass and sapphire;May,2015

3. Comparison of different processes for separation of glass and crystals using ultra short pulsed lasers;Kumkar,2014

4. A method for dicing wafers with laser scribing;Weisshaus,2000

5. Glass cutting method which does not involve breaking;Gaume,2005

Cited by 19 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Advanced techniques in quartz wafer precision processing: Stealth dicing based on filament-induced laser machining;Optics & Laser Technology;2024-04

2. High-Quality Cutting of Soda–Lime Glass with Bessel Beam Picosecond Laser: Optimization of Processing Point Spacing, Incident Power, and Burst Mode;Applied Sciences;2024-02-25

3. Characterization analysis of 355 nm pulsed laser cutting of 6H-SiC;The International Journal of Advanced Manufacturing Technology;2023-12-20

4. Bessel Beam Dielectrics Cutting with Femtosecond Laser in GHz-Burst Mode;Micromachines;2023-08-22

5. Nonstandard Light for Ultrafast Laser Microstructuring and Nanostructuring;Springer Series in Optical Sciences;2023

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP