EUV based multi-patterning schemes for advanced DRAM nodes-Reference-Cited by-同舟云学术

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EUV based multi-patterning schemes for advanced DRAM nodes

Published:2022-05-25 Issue: Volume: Page:
ISSN:
Container-title:Advances in Patterning Materials and Processes XXXIX
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Author:

Das Sayantan,Sah Kaushik,Fallica Roberto,Chen Zhijin,Halder Sandip,Cross Andrew,De Simone Danilo,Treska Fergo,Leray Philippe,Kim Ryoung Han,Maguire Ethan,Wei Chih-I,Fenger Germain,Lafferty Neal,Lee Jeonghoon

Publisher

SPIE

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Advanced pattern-centric solutions for R&D and HVM applications;Metrology, Inspection, and Process Control XXXVIII;2024-04-10

2. Single mask solution to pattern DRAM LILP layer at 42nm pitch using EUV CAR photoresist;Optical and EUV Nanolithography XXXVII;2024-04-10

3. Single mask solution to pattern BLP and SNLP using 0.33NA EUV for next-generation DRAM manufacturing;International Conference on Extreme Ultraviolet Lithography 2022;2022-12-01

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