Metrology and deep learning integrated solution to drive OPC model accuracy improvement

Author:

Yuan Wei,Lu Yifei,Zhao Yuhang,Chen Shoumian,Li Ming,Hu Hongmei,Yao Shuxin,Liu Zhunhua,Li Qiaoqiao,Tian Yu,Zhou Zhiyuan,Gu Lirong,Wang Jinze,Sheng Xichen,Yan Guanyong,Zheng Yazhong,Yao Yueliang,Xiao Yanjun,Liu Liang,Zhao Qian,Feng Mu,Chen Jun,Lang Jun

Publisher

SPIE

Reference14 articles.

1. High-accuracy OPC-modeling by using advanced CD-SEM based contours in the next-generation lithography;Hibino,2010

2. Enabling scanning electron microscope contour-based optical proximity correction models

3. Challenges of OPC Model Calibration from SEM Contours;Granik,2008

4. High-precision contouring from SEM image in 32-nm lithography and beyond;Shindo,2009

5. SEM image contouring for OPC model calibration and verification;Tabery,2007

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