Publisher
SPIE-Intl Soc Optical Eng
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference5 articles.
1. Resolution enhancement of 157 nm lithography by liquid immersion
2. Predicting air entrainment due to topography during the filling and scanning process for immersion lithography
3. D. Gil, T. A. Brunner, C. Fonseca, N. Seong, R. Streefkerk,C. Wagner, and M. Stavenga , “Immersion lithography: New opportunities for semiconductor manufacturing,”The 48th Int. Conf. Electron, Ion and Photon Beam Technology and Nanofabrication, San Diego, CA, June 1–4, 2004.
4. Effect of geometry on steady wetting kinetics and critical velocity of film entrainment
5. A. C. Wei , “Thermofluid simulations for immersion lithography,” PhD Thesis, University of Wisconsin, Madison (2004).
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