Standardized high-performance 640 x 512 readout integrated circuit for infrared applications-Reference-Cited by-同舟云学术

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Standardized high-performance 640 x 512 readout integrated circuit for infrared applications

Published:1999-07-26 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
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Author:

Aziz Naseem Y.,Cannata Robert F.,Kincaid Glenn T.,Hansen Randal J.,Heath Jeffery L.,Parrish William J.,Petronio Susan M.,Woolaway II James T.

Publisher

SPIE

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Infrared Thermography Basics;Infrared Thermography in the Evaluation of Aerospace Composite Materials;2017

2. Readout Integrated Circuit, Measurement, and Testing Technology for Advanced Focal Plane Array;Technology for Advanced Focal Plane Arrays of HgCdTe and AlGaN;2016

3. Measurements of very small temperature variations with LWIR QWIP infrared camera;Infrared Physics & Technology;2015-09

4. A 640×480-17μm ROIC for uncooled microbolometer FPAs;SPIE Proceedings;2015-06-04

5. MT3825BA: a 384×288-25µm ROIC for uncooled microbolometer FPAs;SPIE Proceedings;2014-06-26

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