1. High-performance uncooled amorphous silicon TECless XGA IRFPA with 17μm pixel-pitch;Trouilleau,2009
2. An information-theoretic perspective on the challenges and advances in the race toward 12μm pixel pitch megapixel uncooled infrared imaging;Tisse,2012
3. BAE Systems’ 17μm LWIR Camera Core for Civil, Commercial and Military Applications;Lee,2013
4. Standardized high-performance 640×512 readout integrated circuit for infrared applications;Aziz,1999
5. MT6425CA: A 640×512-25μm CTIA ROIC for SWIR InGaAs Detector Arrays;Eminoglu,2012