New ESCAP-type resist with enhanced etch resistance and its application to future DRAM and logic devices

Author:

Conley Will,Brunsvold William R.,Buehrer Fred,DellaGuardia Ronald,Dobuzinsky David,Farrell Timothy R.,Ho Hok,Katnani Ahmad D.,Keller Robin,Marsh James T.,Muller Paul,Nunes Ronald,Ng Hung Y.,Oberschmidt James M.,Pike Michael,Ryan Deborah,Cotler-Wagner Tina,Schulz Ron,Ito Hiroshi,Hofer Donald C.,Breyta Gregory,Fenzel-Alexander Debra,Wallraff Gregory M.,Opitz Juliann,Thackeray James W.,Barclay George G.,Cameron James F.,Lindsay Tracy K.,Cronin Michael F.,Moynihan Matthew L.,Nour Sassan,Georger, Jr. Jacque H.,Mori Mike,Hagerty Peter,Sinta Roger F.,Zydowsky Thomas M.

Publisher

SPIE

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3. Photolithography;Materials Science and Technology;2013-02-15

4. High sensitivity nonchemically amplified molecular resists based on photosensitive dissolution inhibitors;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2010-11

5. Development of Low Line Edge Roughness and Highly Sensitive Resist for Extreme Ultraviolet Lithography;Japanese Journal of Applied Physics;2007-09-20

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