Modeling ellipsometric measurement of three-dimensional structures with rigorous coupled wave analysis and finite element method simulations
Author:
Affiliation:
1. SUNY Polytechnic Institute, College of Nanoscale Science and Engineering, 257 Fuller Road, Albany, New York 12203, United States
2. Nanometrics, Inc., 1550 Buckeye Drive, Milpitas, California 95035, United States
Publisher
SPIE-Intl Soc Optical Eng
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference14 articles.
1. Application of Mueller polarimetry in conical diffraction for critical dimension measurements in microelectronics
2. Line-profile and critical-dimension monitoring using a normal incidence optical CD metrology
3. Metrology for directed self-assembly block lithography using optical scatterometry
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