Author:
Henn Mark-Alexander,Zhou Hui,Silver Richard M.,Barnes Bryan M.
Reference37 articles.
1. Extending optical inspection to the VUV;Wells,2017
2. Assessing the wavelength extensibility of optical patterned defect inspection;Barnes,2017
3. Optimizing image-based patterned defect inspection through FDTD simulations at multiple ultraviolet wavelengths;Barnes,2017
4. Advanced lithography: wafer defect scattering analysis at DUV;Meshulach,2010
5. Leveraging advanced data analytics, machine learning, and metrology models to enable critical dimension metrology solutions for advanced integrated circuit nodes
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