Multiwavelength Raman characterization of silicon stress near through-silicon vias and its inline monitoring applications-Reference-Cited by-同舟云学术

Multiwavelength Raman characterization of silicon stress near through-silicon vias and its inline monitoring applications

Published:2014-02-05 Issue:1 Volume:13 Page:011205
ISSN:1932-5150
Container-title:Journal of Micro/Nanolithography, MEMS, and MOEMS
language:en
Short-container-title:J. Micro/Nanolith. MEMS MOEMS

Author:

Yoo Woo Sik¹,Kim Jae Hyun²,Han Seung Min³

Affiliation:

1. WaferMasters, Inc., 254 East Gish Road, San Jose, California 95112

2. Korea Advanced Institute of Science and Technology, Graduate School of Energy, Environment, Water and Sustainability, 335 Gwahangno, Yuseong-gu, Daejeon, 305–701, Republic of KoreacSK Hynix, 2091 Gyeongchung-daero, Bubal-eub, Icheon-si, Gyeonggi-do, 467–7

3. Korea Advanced Institute of Science and Technology, Graduate School of Energy, Environment, Water and Sustainability, 335 Gwahangno, Yuseong-gu, Daejeon, 305–701, Republic of Korea

Publisher

SPIE-Intl Soc Optical Eng

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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