Scanning acoustic gigahertz microscopy for metrology applications in three-dimensional integration technologies-Reference-Cited by-同舟云学术

Scanning acoustic gigahertz microscopy for metrology applications in three-dimensional integration technologies

Published:2014-02-20 Issue:1 Volume:13 Page:011207
ISSN:1932-5150
Container-title:Journal of Micro/Nanolithography, MEMS, and MOEMS
language:en
Short-container-title:J. Micro/Nanolith. MEMS MOEMS

Author:

Brand Sebastian¹,Lapadatu Adriana²,Djuric Tatjana³,Czurratis Peter³,Schischka Jan¹,Petzold Matthias¹

Affiliation:

1. Fraunhofer Institute for Mechanics of Materials IWM, Center for Applied Microstructure Diagnostics CAM, 06120 Halle, Germany

2. Sensonor, 3194 Horten, Norway

3. PVA TePla Analytical Systems GmbH, 73463 Westhausen, Germany

Publisher

SPIE-Intl Soc Optical Eng

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Extending acoustic microscopy for comprehensive failure analysis applications

2. High resolution acoustical imaging of high-density-interconnects for 3D-integration;Brand,2011

3. 3D sensor application with open through silicon via technology;Kraft,2011

4. Channel defect detection in food packages using integrated backscatter ultrasound imaging

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