Metrology needs for through-silicon via fabrication-Reference-Cited by-同舟云学术

Metrology needs for through-silicon via fabrication

Published:2014-02-27 Issue:1 Volume:13 Page:011206
ISSN:1932-5150
Container-title:Journal of Micro/Nanolithography, MEMS, and MOEMS
language:en
Short-container-title:J. Micro/Nanolith. MEMS MOEMS

Author:

Vartanian Victor¹,Allen Richard A.²,Smith Larry¹,Hummler Klaus¹,Olson Steve³,Sapp Brian¹

Affiliation:

1. 3D Center, SEMATECH, 257 Fuller Road, Suite 2200 Albany, New York 12203

2. National Institute of Standards and Technology, Semiconductor & Dimensional Metrology Division, 100 Bureau Drive, Stop 8120, Gaithersburg, Maryland 20899-8120

3. 3D Center, SEMATECH, 257 Fuller Road, Suite 2200 Albany, New York 12203cState University of New York at Albany, College of Nanoscience and Engineering, Albany, New York 12203

Publisher

SPIE-Intl Soc Optical Eng

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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