Progress toward the development of manufacturable integrated optical data buses-Reference-Cited by-同舟云学术

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Progress toward the development of manufacturable integrated optical data buses

Published:2004-06-10 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
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Author:

Pugliano Nick,Chiarroto Nancy,Fisher John,Heiks Noel,Ho Tuan,Khanarian Garo,Moynihan Matthew,Pawlowski Nathan,Shelnut Jim,Sherrer David,Sicard Bruno,Zheng Hai-Bin

Publisher

SPIE

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards;Journal of Electronic Packaging;2011-09-01

2. Flexible optical interconnects based on silicon-containing polymers;SPIE Proceedings;2009-02-12

3. Synthesis of liquid polysilisiquioxane resins and properties of cured films;Thin Solid Films;2008-11

4. Design and analysis of 3D stacked optoelectronics on optical printed circuit boards;SPIE Proceedings;2008-02-07

5. A Study on Liquid Hybrid Material for Waveguides—Synthesis and Property of PSQ‐Ls for Waveguides;Journal of Macromolecular Science, Part A;2008-02

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