Reduction of soldering induced stresses in solar cells by microstructural optimization of copper-ribbons-Reference-Cited by-同舟云学术

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Reduction of soldering induced stresses in solar cells by microstructural optimization of copper-ribbons

Published:2011-09-08 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
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Author:

Meier R.,Pander M.,Klengel R.,Dietrich S.,Klengel S.,Ebert M.,Bagdahn J.

Publisher

SPIE

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Manufacturing Induced Bending Stresses: Glass-Glass vs. Glass-Backsheet;2021 IEEE 48th Photovoltaic Specialists Conference (PVSC);2021-06-20

3. Thermomechanical stress in solar cells: Contact pad modeling and reliability analysis;Solar Energy Materials and Solar Cells;2019-07

4. Enabling the measurement of thermomechanical stress in solar cells and PV modules by confocal micro-Raman spectroscopy;Solar Energy Materials and Solar Cells;2019-05

5. Conductive-paste-based high-yielding interconnection process for c-Si photovoltaic modules with 50 µm thin cells;Solar Energy Materials and Solar Cells;2018-06

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