High-accuracy three-dimensional shape measurement of micro solder paste and printed circuits based on digital image correlation
Author:
Affiliation:
1. CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics, U
2. National University of Defense Technology, Changsha
Publisher
SPIE-Intl Soc Optical Eng
Subject
General Engineering,Atomic and Molecular Physics, and Optics
Reference46 articles.
1. Automatic Inspection System for Printed Circuit Boards
2. Automated Visual Inspection: A Survey
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4. Image fusion and subpixel parameter estimation for automated optical inspection of electronic components
5. Automatic optical inspection for detecting defects on printed circuit board inner layers
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