Subsurface mechanical damage correlations after grinding of various optical materials
Author:
Affiliation:
1. Lawrence Livermore National Laboratory, Livermore, California
Publisher
SPIE-Intl Soc Optical Eng
Subject
General Engineering,Atomic and Molecular Physics, and Optics
Reference22 articles.
1. Influence of partial charge on the material removal rate during chemical polishing
2. Nanoplastic removal function and the mechanical nature of colloidal silica slurry polishing
3. MRF applications: measurement of process-dependent subsurface damage in optical materials using the MRF wedge technique
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