Novel EUV resist materials design for 14nm half pitch and below
Author:
Affiliation:
1. FUJIFILM Corp. (Japan)
Publisher
SPIE
Reference41 articles.
1. ITRS, The International Technology Roadmap for Semiconductors (2011).
2. Critical challenges for EUV resist materials
3. EUV resist performance: current assessment for sub-22-nm half-pitch patterning on NXE:3300
4. Evaluation of EUV resist materials for use at the 32 nm half-pitch node
5. EUV resist materials design for 15 nm hp and below;Tsubaki,2012
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