Theoretical study of relationships among resolution, line width roughness, and sensitivity of chemically amplified extreme ultraviolet resists with photodecomposable quenchers
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/55/i=11/a=116501/pdf
Reference46 articles.
1. Chemical amplification in the design of dry developing resist materials
2. Chemical Amplification Resists for Microlithography
3. Soft x-ray reduction lithography using multilayer mirrors
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Relationship between Defect Risks and Effective Reaction Radius for Deprotection in Chemically Amplified Resist Process for Extreme Ultraviolet Lithography;Journal of Photopolymer Science and Technology;2024-05-31
2. Design strategy of extreme ultraviolet resists;Japanese Journal of Applied Physics;2024-05-01
3. Resist image quality control via acid diffusion constant and/or photodecomposable quencher concentration in the fabrication of 11 nm half-pitch line-and-space patterns using extreme-ultraviolet lithography;Japanese Journal of Applied Physics;2018-04-19
4. Relationship between sensitizer concentration and resist performance of chemically amplified extreme ultraviolet resists in sub-10 nm half-pitch resolution region;Japanese Journal of Applied Physics;2016-11-25
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