Critical dimension control using ultrashort laser for improving wafer critical dimension uniformity-Reference-Cited by-同舟云学术

Critical dimension control using ultrashort laser for improving wafer critical dimension uniformity

Published:2015-09-11 Issue:3 Volume:14 Page:033510
ISSN:1932-5150
Container-title:Journal of Micro/Nanolithography, MEMS, and MOEMS
language:en
Short-container-title:J. Micro/Nanolith. MEMS MOEMS

Author:

Avizemer Dan¹,Sharoni Ofir¹,Oshemkov Sergey¹,Cohen Avi¹,Dayan Asaf²,Khurana Ranjan³,Kewley Dave³

Affiliation:

1. Carl Zeiss SMS Ltd., 44 Maale Camon, Karmiel 21613, Israel

2. Carl Zeiss SBE, LLC, SMS Division, One Corporation Way, Peabody, Massachusetts 01960, United States

3. Micron Technology, Inc., 8000 South Federal Way, Boise, Idaho 83707, United States

Publisher

SPIE-Intl Soc Optical Eng

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. CD variations correction by local transmission control of photomasks done with a novel laser-based process

2. Process window improvement on 45nm technology non volatile memory by CD uniformity improvement

3. A study of closed-loop application for logic patterning

4. Short-Pulse Laser Damage in Transparent Materials as a Function of Pulse Duration

5. Ultrafast-laser driven micro-explosions in transparent materials

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1. How to improve intra-field CDU of contact hole patterns in both X-Y directions with CDC technology;Photomask Technology 2023;2023-11-21

2. Study on the highly intelligent uniformity correction and the application for lithography;Sixth International Conference on Optical and Photonic Engineering (icOPEN 2018);2018-07-24

3. High Precision Correction Method of Illumination Field Uniformity for Photolithography Illumination System;Acta Optica Sinica;2018

4. Improving mask registration and wafer overlay control using an ultrashort pulsed laser;Journal of Micro/Nanolithography, MEMS, and MOEMS;2016-06-09