Development of lossy and near-lossless compression methods for wafer surface structure digital holograms-Reference-Cited by-同舟云学术

Development of lossy and near-lossless compression methods for wafer surface structure digital holograms

Published:2015-08-03 Issue:4 Volume:14 Page:041304
ISSN:1932-5150
Container-title:Journal of Micro/Nanolithography, MEMS, and MOEMS
language:en
Short-container-title:J. Micro/Nanolith. MEMS MOEMS

Author:

Zhang Hongbo¹,Zhou Wenjing²,Leber Donald¹,Hu Zhijuan³,Yang Xin⁴,Tsang Peter W. M.⁵,Poon Ting-Chung¹

Affiliation:

1. Virginia Tech, Bradley Department of Electrical and Computer Engineering, Perry Street, Blacksburg, Virginia 24060, United States

2. Virginia Tech, Bradley Department of Electrical and Computer Engineering, Perry Street, Blacksburg, Virginia 24060, United StatesbShanghai University, Department of Precision Mechanical Engineering, 149 Yanchang Road, Shanghai 200072, China

3. Shanghai Normal University, Mathematics and Science College, 100 Guilin Road, Shanghai 200234, China

4. Soochow University, Institute of Information Optics Engineering, 1 Shixin Street, Suzhou, Jiangsu 210056, China

5. City University of Hong Kong, Department of Electronic Engineering, 83 Tat Chee Avenue, Kowloon, Hong Kong, China

Publisher

SPIE-Intl Soc Optical Eng

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference40 articles.

1. Exploiting sub-20-nm complementary metal-oxide semiconductor technology challenges to design affordable systems-on-chip

2. Extreme ultraviolet mask defect inspection with a half pitch 16-nm node using simulated projection electron microscope images

3. Patterned mask inspection technology with projection electron microscope technique on extreme ultraviolet masks

4. Mapping of Electrostatic Potential in Deep Submicron CMOS Devices by Electron Holography

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