Process monitoring using automatic physical measurement based on electrical and physical variability analysis-Reference-Cited by-同舟云学术

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Process monitoring using automatic physical measurement based on electrical and physical variability analysis

Published:2015-07-03 Issue:2 Volume:14 Page:021107
ISSN:1932-5150
Container-title:Journal of Micro/Nanolithography, MEMS, and MOEMS
language:en
Short-container-title:J. Micro/Nanolith. MEMS MOEMS

Author:

Shauly Eitan N.¹,Levi Shimon²,Schwarzband Ishai²,Adan Ofer²,Latinsky Sergey²

Affiliation:

1. TowerJazz Semiconductor Ltd., P.O. Box 619, Migdal Ha’Emek 23105, IsraelbTechnion-Israel Institute of Technology, Department of Material Science and Engineering, Haifa 32000, Israel

2. Applied Materials, Inc., 9 Oppenhimer Street, Rehovot 76705, Israel

Publisher

SPIE-Intl Soc Optical Eng

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Automated mask and wafer defect classification using a novel method for generalized CD variation measurements;Metrology, Inspection, and Process Control for Microlithography XXXII;2018-03-13

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